MBR10150CT 10 amp high voltage features ? high junction temperature capability ? low leakage current mcc catalog number maximum re current peak reverse voltage maximum rms voltage maximum dc blocking voltage mbr 10150 ct 150 v 105v 150 v electrical characteristics @ 25 c unless otherwise specified average forward current i f(av) 10 a t c =125 c peak forward surge current i fsm 120a 8.3ms half sine maximum instantaneous forward voltage m br 1 01 50 ct v f .9 2 v i fm =5a t j =25 c 150volts barrier rectifier power schottky revision: 7 2008/01/01
omponents 20736 marilla street chatsworth
mcc to-220ab tm micro commercial components www. mccsemi .com 1 of 4 x marking : type number min max note a .560 .625 14.22 15.88 b .380 .420 9.65 10.67 c .140 .190 3.56 4.82 d .020 .045 0.51 1.14 f .139 .161 3.53 4.09 ? g .190 .110 2.29 2.79 h --- .250 --- 6.35 j .012 .025 0.30 0.64 k .500 .580 12.70 14.73 l .045 .060 1.14 1.52 n .190 .210 4.83 5.33 q .100 .135 2.54 3.43 r .080 .115 2.04 2.92 s .045 .055 1.14 1.39 t .230 .270 5.84 6.86 u ----- .050 ----- 1.27 v .045 ----- 1.15 ----- dimensions inches mm dim min max pin 1 pin 3 pin 2 case g r b q h u l d c j k a f s t 1 3 2 n v ? lead free finish/rohs compliant(note 1) ("p" suffix designates rohs compliant. see ordering information) maximum ratings ? operating junction temperature : 150c ? storage temperature: - 50 c to +150 c ? per d iode thermal resistance 4c/w junction to case ? case material: molded plastic. ul flammability classificationrating94v-0 and msl rating 1 notes: 1. high temperature solder exemption applied, see eu directive annex 7. i fm =5a t j =125c .75v maximum reverse current at rated dc blocking voltage t j =125c 7ma t j =25c i r 50ua
MBR10150CT 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 if(av) (a) pf(av)(w) = 0.05 = 0.1 = 0.2 = 0.5 = 1 t =tp/t tp fig. 1: average forward power dissipation versus average forward current (per diode). 1e-3 1e-2 1e-1 1e+0 0 10 20 30 40 50 60 70 80 t(s) im(a) tc=50c tc=75c tc=125c i m t =0.5 fig. 3: non repetitive surge peak forward current versus overload duration (maximum values, per diode). 1e-3 1e-2 1e-1 1e+0 0.0 0.2 0.4 0.6 0.8 1.0 tp(s) zth(j-c)/rth(j-c) = 0.5 = 0.2 = 0.1 single pulse t =tp/t tp fig. 4: relative variation of thermal impedance junction to case versus pulse duration (per diode). 0 25 50 75 100 125 150 1e-2 1e-1 1e+0 1e+1 1e+2 1e+3 1e+4 1e+5 vr(v) ir(a) tj=75c tj=25c tj=125c tj=150c tj=175c fig. 5: reverse leakage current versus reverse voltage applied (typical values, per diode) 1 2 5 10 20 50 100 200 10 20 50 100 200 vr(v) c(pf) f=1mhz tj=25c fig. 6: junction capacitance versus reverse voltage applied (typical values, per diode). mcc revision: 7 2008/01/01 average forward current. (a) 0 50 100 150 0 2 10 case temperature. ( c) o resistive or inductive load 8 6 4 fig.2- forward current derating curve tm micro commercial components www. mccsemi .com 2 of 4
MBR10150CT 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 0.1 1.0 10.0 100.0 vfm(v) ifm(a) tj=125c tj=25c tj=125c typical values fig. 7: forward voltage drop versus forward current (maximum values, per diode). 0 2 4 6 8 101214161820 0 10 20 30 40 50 60 70 80 s(cm2) rth(j-a) (c/w) fig. 8: thermal resistance junction to ambient versus copper surface under tab (epoxy printed circuit board, copper thickness: 35m) mcc revision: 7 2008/01/01 tm micro commercial components www. mccsemi .com 3 of 4
mcc revision: 7 2008/01/01 tm micro commercial components www. mccsemi .com 4 of 4 products are represented on our website, harmless against all damages. ***applications disclaimer*** ***important notice*** aerospace or military applications. products offer by micro commercial components corp . are not intended for use in medical, micro commercial components corp . reserves the right to make changes without further notice to any product herein to make corrections, modifications , enhancements , improvements , or other changes . micro commercial components corp . does not assume any liability arising out of the application or use of any product described herein; neither does it convey any license under its patent rights ,nor the rights of others . the user of products in such applications shall assume all risks of such use and will agree to hold micro commercial components corp . and all the companies whose ordering information device packing (part number)-bp bulk;1kpcs/box
|
